BoardLok HW is specially formulated to address bonding issues with heavy weight papers and multi-wall board, with specific attention to edge delamination and is a convenient, ready-to-use liquid that is ideal for automated systems, BoardLok HW delivers higher speeds and improved bonding on all grades of paper and board combinations including heavy weight, double wall, triple wall and difficult to penetrate substrates. This formulation helps eliminate edge delamination on triple-wall.
OPERATIONAL BENEFITS
PACKAGING
We offer a deep dive evaluation into your operations, a weeklong engagement to identify corrugator and control system issues and insure everything is working as designed when we leave. And we'll quantify the ROI you'll see from the results of our engagement.
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